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What is an Application-Specific Integrated Circuit (ASIC)?
There was a time when discrete components such as resistors, capacitors, inductors, transistors, and diodes sufficed for many electrical design projects. Today, however, it's uncommon to find a circuit board without at least one integrated circuit (IC), and many boards are packed with ICs of various shapes and sizes. The widespread use of ICs in contemporary electrical engineering is closely tied to the vast selection of microchips that engineers can easily locate, evaluate, purchase, and implement. Nevertheless, off-the-shelf ICs sometimes fail to deliver an optimized solution, prompting engineers to explore the option of using application-specific integrated circuits (ASICs).
AliceNovember 28, 2024Onsemi Launches Modular Analog and Mixed-Signal SoC Platform
Onsemi has introduced its advanced Treo platform, a modular analog and mixed-signal system that integrates multiple functions—including power management, sensor interfaces, and communication subsystems—into a single, modular architecture. The platform is designed to meet the high-performance demands of automotive, medical, industrial, and AI data center applications.
AliceNovember 28, 2024Siemens Unveils AI-Enhanced Electronic Systems Design Software
Siemens has unveiled upgrades and AI enhancements to its flagship electronics design suite. The suite integrates updated tools and multidisciplinary project lifecycle management (PLM) with cloud-based collaboration and enhanced security. While printed circuit board (PCB) design remains at the core of the suite, the new version spans the entire design process and takes full advantage of cloud computing and artificial intelligence (AI).
AliceNovember 28, 2024AMD First to Launch FPGA Devices Featuring CXL 3.1 and PCIe Gen6
At Electronica, AMD introduced the Versal Premium Series Gen 2, the industry's first FPGA platform to support CXL 3.1 and PCIe Gen6.
AliceNovember 28, 2024A Comprehensive Overview of Winbond's Memory Technology for Edge AI
AI computing is recognized as one of the most critical technological areas in semiconductor memory. For AI edge computing, Winbond offers a memory technology called Customized Ultra-Bandwidth Elements (CUBE), designed to enable high-performance, optimized generative AI processing for hybrid edge/cloud applications. In this article, we will take a deep dive into this technology and explore how it addresses the challenges engineers face when developing edge AI computing systems.
AliceNovember 28, 2024What Are MRDIMMs? The Memory Technology Servers Designers Are Discussing
As the demand for data-intensive workloads continues to rise, modern servers are under increasing pressure to match computational power with memory bandwidth. Industries like artificial intelligence, high-performance computing, and real-time analytics rely on memory subsystems capable of delivering data at extraordinarily high speeds to avoid bottlenecks.
AliceNovember 28, 2024TinyML in Action: Building a Voice-Controlled Robotic Subsystem
Before we dive into our real-world project, it's crucial to establish a solid understanding of the foundational concepts of TinyML.
AliceNovember 27, 2024Power Dissipation of a CMOS Inverte
The development of the CMOS inverter marked a significant turning point in technology history, providing essential functionality for integrated circuits. This logic circuit showcases the unique electrical properties of CMOS, making it particularly suitable for high-density, high-performance digital systems. One of the primary advantages of CMOS technology is its efficiency: current flows only during state transitions, meaning that when a CMOS circuit maintains a logic high or low, it consumes very little power. This low power dissipation is especially beneficial when trying to integrate as much transistor functionality as possible into a compact space. Effective heat dissipation is critical for integrated circuits, and the CMOS inverter plays a vital role in this process. In this first part of a three-part series, we will review the key characteristics of the CMOS inverter and discuss its two main types of power dissipation: dynamic power and static power. Subsequent articles will delve deeper into the mechanisms of dynamic power dissipation.
AliceNovember 27, 2024Electromagnetic Side-Channel Attacks on Cryptographic Systems
Electromagnetic (EM) attacks stand out as particularly powerful. In this article, we will delve into the mechanics of EM attacks, exploring how they function and examining specific types of power attacks that have historically compromised cryptography.
AliceNovember 27, 2024An Introduction to RISC-V—Understanding RISC’s Open ISA
RISC-V is an open instruction set architecture (ISA) that has gained significant traction as a viable alternative to proprietary architectures such as ARM. Since its inception, RISC-V has steadily increased in popularity in both academic and commercial sectors.
AliceNovember 27, 2024- 1