Onsemi has introduced its advanced Treo platform, a modular analog and mixed-signal system that integrates multiple functions—including power management, sensor interfaces, and communication subsystems—into a single, modular architecture. The platform is designed to meet the high-performance demands of automotive, medical, industrial, and AI data center applications.
Siemens has unveiled upgrades and AI enhancements to its flagship electronics design suite. The suite integrates updated tools and multidisciplinary project lifecycle management (PLM) with cloud-based collaboration and enhanced security. While printed circuit board (PCB) design remains at the core of the suite, the new version spans the entire design process and takes full advantage of cloud computing and artificial intelligence (AI).
At Electronica, AMD introduced the Versal Premium Series Gen 2, the industry's first FPGA platform to support CXL 3.1 and PCIe Gen6.
AI computing is recognized as one of the most critical technological areas in semiconductor memory. For AI edge computing, Winbond offers a memory technology called Customized Ultra-Bandwidth Elements (CUBE), designed to enable high-performance, optimized generative AI processing for hybrid edge/cloud applications. In this article, we will take a deep dive into this technology and explore how it addresses the challenges engineers face when developing edge AI computing systems.
As the demand for data-intensive workloads continues to rise, modern servers are under increasing pressure to match computational power with memory bandwidth. Industries like artificial intelligence, high-performance computing, and real-time analytics rely on memory subsystems capable of delivering data at extraordinarily high speeds to avoid bottlenecks.