Bergquist

Henkel's BERGQUIST® brand offers a comprehensive thermal management materials suite tailored to enhance heat dissipation reliability in advanced electronic devices. BERGQUIST GAP PAD® gap-filling thermal interface materials (TIMs) utilize pre-cut, compliant pads that reduce assembly strain and deliver efficient thermal conductivity. For intricate geometries and high-volume production, automated BERGQUIST Gap Filler liquid TIMs are optimal. The extensive thermal solutions portfolio encompasses SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials, and TCLAD® Insulated Metal Substrates (IMS®).