Electronic Parts

Product Details

Devcon

21500

$ 17.987

Datasheet

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Devcon Devweld 531 Mma 50ML Cart

Price and Availability
Product Parameters
Case/Package
Epoxy
Color
White
Max Operating Temperature
120 °C
Min Operating Temperature
-55 °C
Mount
Adhesive
REACH SVHC
No SVHC
RoHS
Compliant
Descriptions

Descriptions of Devcon 21500 provided by its distributors.

Devweld 531 is a two-part 1:1 ratio methacrylate adhesive designed for structural bonding of thermoplastic, metal and composite assemblies. Devweld 531 is particularly well suited for bonding thermoplastic materials and combines high strength and stiffness with the ability to adhere difficult-to-bond materials. Features: Excellent shear, peel and impact strength. Non-sagging. Will fill gaps of up to 4mm. Excellent load bearing qualities. Resistant to weathering and humidity. Specifically designed for difficult-to-bond. Room temperature cure. No surface preparation. 100% reactive.

Zoro UK

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