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NXP Semiconductors BAP64-03,115

BAP64-03,115

Product Attributes
TYPE
DESCRIPTION
Contact Plating
Tin
Diode Type
PIN - Single
Element Configuration
Single
Forward Current
100 mA
Forward Voltage
1.1 V
Height
1.05 mm
Lead Free
Lead Free
Length
1.8 mm
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
500 mW
Max Repetitive Reverse Voltage (Vrrm)
175 V
Max Reverse Voltage (DC)
175 V
Min Operating Temperature
-65 °C
Mount
Surface Mount
Number of Pins
2
Packaging
Cut Tape
Power Dissipation
500 mW
Radiation Hardening
No
REACH SVHC
No SVHC
Reverse Voltage
175 V
Reverse Voltage (DC)
175 V
RoHS
Compliant
Schedule B
8541100060
Termination
SMD/SMT
Test Current
100 mA
Width
1.35 mm
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