Products
Distributors
Manufacturers
- Intel
- Samsung
- Texas Instruments
- STMicroelectronics
- Infineon
- NXP Semiconductors
- Microchip
- Analog Devices
- onsemi
- Skyworks Solutions
- Avago
- Marvell
- Omnivision Technologies
- ROHM
- Seoul Semiconductor
- Silego
- Cirrus Logic
- Silicon Labs
- Lattice Semiconductor
- Cypress Semiconductor
- Toshiba
- Mitsubishi
- Panasonic
- Sharp
- Omnetics
- Laird
- TDK-Lambda
- WAGO
- All Distributors
RN55C2001FB14
Product Attributes
TYPE
DESCRIPTION
Case/Package
Conformal
Composition
Metal Film
Contact Plating
Lead, Tin
Diameter
2.29 mm
Features
Flame Retardant Coating, Military, Moisture Resistant
Lead Diameter
640 µm
Lead Free
Contains Lead
Length
7.06 mm
Max Operating Temperature
175 °C
Max Power Dissipation
125 mW
Military Standard
MIL-R-10509
Min Operating Temperature
-65 °C
Number of Pins
2
Number of Terminations
2
Packaging
Bulk
Power Rating
125 mW
Radiation Hardening
No
REACH SVHC
Unknown
Resistance
2 kΩ
RoHS
Non-Compliant
Temperature Coefficient
50 ppm/°C
Termination
Axial
Tolerance
1 %
Voltage Rating
200 V
Voltage Rating (DC)
200 V
Width
2.29 mm
Wire/Cable Diameter
50.8 µm
Similar Products